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Thermal Interface Material (TIM)

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ZEON　Thermal Interface Material VB200

Zeon’s standard grade, VB200 is a sheet-type thermal interface material (TIM) developed based on a special elastomer designed to solve the thermal management issues associated with the miniaturization and high integration of electronic devices in recent years.

Vertical filler orientation creates efficient heat path.
  • High thermal conductivity

    38W/m K*1in the thickness direction (Z axis)

  • Thickness availability

    Thin sheets available using special processing technology

  • Long term durability

    Suppresses degradation of thermal resistance during heat cycle testing

  1. *1 Not guaranteed as it is a measurement value

VB200 Typical applications

Typical applications

Fill gaps between heat-generating parts such as IC chips and heat-dissipating parts such as heat sinks, and efficiently transfer heat by taking advantage of high thermal conductivity.

Example of use

Zeon’s TIM can be applied to both TIM 1 and 2 applications.

Basic Properties/Thermal Resistance Comparison

Basic properties 【 VB200 】
Properties Units Value
Thickness μm 100～260*1
Thermal conductivity
（Z-direction）		 (W/m・K) 38*2
Compressibility ％ 11*3
Flame retardance（UL94） - Equivalent to
V-0
  1. *1For thicknesses outside this range, please contact us.
  2. *2This is a measured value and not guaranteed.
    Those above data are measured values and not guaranteed values.
  3. *3Measured under the following conditions:
    Thickness 100µm, Temperature 50℃, Pressure 0.3MPa.
Figure: Thermal resistance
  • *This is a measured value and not guaranteed.
  • *The data above is the actual measurement data at Zeon based on ASTM D5470.

Durability Testing
【High Temp. Long Term Storage and Heat Cycling】

Method

  • Form the structure above（Copper plate＋TIM＋aluminum plate） and conduct heat resistance and durability testing.
  • Evaluate the thermal resistance of the structure.
Conditions for High temperature Long term Storage
Process Temperature [℃] Time
Long term Heating 150 1000hrs
Conditions 【 150℃ 】
Conditions for heat cycle testing
Process Temperature [℃] Time
Cooling -55 30 min.
Heating 150 30 min.
Time per 1 cycle 60 min.
Conditions 【Heat cycle　-55↔150℃ 】

Thermal performance maintains even after heat cycle testing and
long term high temperature exposure condition.

Durability Testing　【Reflow testing】

Test condition

  1. 1Feed the VB200 into the reflow oven at a transfer speed of 0.3 m/min.
  2. 2During reflow, temperatures were held above 200°C for 1 minute with a maximum temperature of 260°C.
  3. 3Repeat the reflow up to 10 times on the same sample.
  4. 4Thermal diffusivity is measured after each reflow.

The thermal diffusivity of VB200 showed almost the same performance as the initial value
after 10 reflow cycles.

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